MG/OG series products consists of micron diamondabrasives embedded in structure of matrix of high-performance polymers. Theresin structures are mounted on a textile base or on a synthetic film. Thetextile base absorbs vibration s and thus improves surface quality. Thesynthetic film base is used where maximum material removal rate are required.
Features and Recommended Application of MSY seriesproducts:
Precisiongraded micron diamond sizes A narrowparticle size distribution allows for bothsuperior surface quality and highest material removal rate.
Easy handling MG/OG seriesgrinding pads can be used on any standard lapping or polishing machine. The mounting options (stainless steel carrier orself-adhesive backing) are designed forquick and easy changes of grit size.
Long tool life The massive abrasive layer allows for long tool life,minimal set-up time and low processcost.
Self-sharpening MG/OG seriesgrinding pads can be used out of the box without dressing. Thanks to the self-sharpening bond system, the diamondgrinding disc does not requireconditioning during the process to continuously achieve excellent grindingresults.
Versatile MG/OG can be used to grind a wide range of materialssuch as steel, stainless steel, steel alloys, opticalglasses, various crystals, industrial ceramics, ceramic seals ,engineering plastics and so on.
