CP-610R2-SVI Chemical Mechanical Polishing Machine
Reliable supplier of semiconductor precision chemical mechanical polishing.
Siemens PLC and Touch screen(4.3"), TECO motor, ensure product quality.
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HDS-1000 Double side Lapping Machine
The HDS series double-sided grinding machine is designed for high-intensity and high-precision precision grinding processes. Unlike the LDS series doubl e-sided l apping ma chine, the HDS equipment features a top-mounted reduction motor directly driving the grinding wheel, reducing transmission gaps and collisions, and increasing the smoothness of equipment operation. Additionally, the downward pressure on the top wheel is controlled by a closed-loop pressure control system, which includes airbags and load sensor, ensuring precise pressure control and stable equipment operation. Even during heavy cutting processes with high intensity, the HDS equipment can maintain stable operation while achieving high machining precision.
